MINNEAPOLIS–(BUSINESS WIRE)–CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, announced today that it received a 2020 GLOBAL Technology Award in the Test & Inspection – SPI category for its SQ3000™ Multi-Function for AOI, SPI and CMM. The award was announced during a Virtual Awards Ceremony on Tuesday, Sept. 29, 2020. The GLOBAL Technology Award is the fifth award that the company has received for the system and the twentieth award for Multi-Function Suppression™ (MRS) sensor technology solutions.

CyberOptics’ SQ3000 multi-function system can identify critical defects and measure critical parameters, providing a superior process control solution for effective yield management.

In addition to AOI and SPI applications, highly accurate coordinate measurements can be attained faster than a traditional Coordinate Measurement Machine (CMM) – in seconds, not hours.

The world’s first in-line CMM includes an extensive software suite for metrology grade measurements on all critical points. In addition, the latest 3D AOI software enables ultra-fast programming capabilities, auto tuning and enhancements that significantly speed setup, simplify the process, reduce training efforts and minimize operator interaction.

“We’re honored to receive the 2020 GLOBAL Technology Award for the SQ3000 Multi-Function System,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics, “Customers are valuing the system’s flexibility and versatility with the best combination of high speed, high resolution and high accuracy. They are recognizing significant results in terms of improved process control and yields, particularly for the most challenging applications where our technology really shines.”

Powered by proprietary MRS sensor technology, the 3D SQ3000 all-in-one system offers an unmatched combination of high speed, high resolution and high accuracy. The MRS sensor meticulously identifies and rejects reflections caused by shiny components making it an ideal technology solution for a wide range of applications with stringent requirements. The Ultra-High Resolution MRS sensor option delivers superior performance ideally suited for socket metrology, micro and mini-LED, microelectronics and other applications where an even greater degree of accuracy and inspection reliability is critical.

The GLOBAL Technology Awards have recognized the very best new innovations in the printed circuit assembly and packaging industries since 2005. The prestigious awards contest has been bringing together the global SMT and advanced packaging industry in a celebration of the companies and people that are achieving the highest standards and driving our industry forward. For more information, visit www.globalsmt.net/awards.

For more information, visit www.cyberoptics.com.

About CyberOptics

CyberOptics Corporation (www.cyberoptics.com) is a leading global developer and manufacturer of high-precision 3D sensing technology solutions. CyberOptics’ sensors are used for inspection and metrology in the SMT and semiconductor markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the Company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.

Statements regarding the Company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: a possible world-wide recession or depression resulting from the economic consequences of the Covid-19 pandemic; the negative effect on our revenue and operating results of the Covid-19 crises on our customers and suppliers and the global supply chain; market conditions in the global SMT and semiconductor capital equipment industries; trade relations between the United States and other countries; the timing of orders and shipments of our products, particularly our 3D MRS-enabled SQ3000 Multi-Function systems and MX systems for memory module inspection; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required to meet customer orders; unanticipated product development challenges; the effect of world events on our sales, the majority of which are from foreign customers; rapid changes in technology in the electronics and semiconductor markets; product introductions and pricing by our competitors; the success of our 3D technology initiatives; the market acceptance of our SQ3000 Multi-Function inspection and measurement systems and products for semiconductor advanced packaging inspection and metrology; costly and time consuming litigation with third parties related to intellectual property infringement; the negative impact on our customers and suppliers due to past and future terrorist threats and attacks and any acts of war; and other factors set forth in the Company’s filings with the Securities and Exchange Commission.