Home FEATURED NEWS ‘India will quickly make gear for semiconductor manufacturing’

‘India will quickly make gear for semiconductor manufacturing’

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India will quickly begin making equipment for semiconductor manufacturing, Union telecom and IT minister Ashwini Vaishnaw stated on Saturday.”The entire semiconductor ecosystem of fabs, ATMP units, chemicals, gases, substrate, consumables and equipment for semiconductor manufacturing will be made in India,” he stated.

He was talking on the inauguration of American chip gear provider Applied Materials‘ India Validation Centre in Bengaluru which was arrange at a value of $20 million.


Such labs are current within the US, Singapore, China and Korea. The India Validation Centre could have a workforce of 500 folks.

The firm final 12 months introduced that it’s going to arrange an engineering centre in Bengaluru with a complete funding of $400 million over 4 years to develop and commercialise applied sciences for semiconductor manufacturing gear.

Vaishnaw stated that the parts that had been earlier imported from Japan, Korea and Taiwan are being made by the corporate right here now.

“Today, all the four agreements made during the Prime Minister’s state visit to the US have been materialised,” Vaishnaw stated.

The building of Micron’s ATMP has commenced. In addition, LAM Research’s proposal to ship a digital nano fabrication surroundings via its Semiverse Solutions to coach semiconductor engineers in India has additionally began.

“The first training course in the Indian Institute of Science has started with 35 students,” the minister stated. The third settlement was in relation to a centre of Applied Materials to be arrange in India, he stated. “This has also fructified with a centre of the company being set up here,” he stated.

A design centre of Advanced Micro Devices (AMD) was additionally to be arrange in India. “A few months back, I inaugurated the design centre of AMD in Bengaluru,” Vaishnaw stated.

A primary for 300 mm wafer processing

Sonny Kunnakkat, managing director, Advanced Manufacturing Technology, Worldwide Operations, Applied Materials, informed ET that that is the primary non-public facility in India that may course of 300 mm wafers.

So far, 200 mm wafers have been processed in India.

“We used to have a 300 mm processing facility in the Indian Institute of Technology but that was academic. This is a commercial one. We will do our own development work. The wafers that we make are not sold as we are an equipment company and not a chip company. Our equipment here will go to our customers to make their chips,” Kunnakkat stated.

The change charge of the gear could be very quick, he stated. Equipment and parts should be repeatedly developed with evolving buyer challenges. “That is the kind of development that will be done here,” he stated.

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